Tantalum metal has been deposited with sub-nanometer control for the first time at low temperature without plasma by Wayne State University scientists Kyle Blakeney and Professor Charles Winter “This opens up the prospect of using tantalum in layers just a few nanometers thick as the liner for interconnect wiring in the complex geometries of next-generation electronic chips,” ...
First low temperature tantalum deposition with fab-level accuracy
from News – ElectronicsWeekly http://ift.tt/2aKazSO
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