Advanced Semiconductor Engineering (ASE) and Deca Technologies, a subsidiary of Cypress Semiconductor, have announced the signing of an agreement whereby ASE will invest US$60 million in Deca and will license Deca's M-Series fan-out wafer-level packaging (FOWLP) technologies and processes.
from DIGITIMES: IT news from Asia http://ift.tt/1TiaO58
via Yuichun
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