VIAVI has published the details of a recent O-RAN PlugFest VIAVI and Rohde & Schwarz partnered on O-RAN Fronthaul (OFH) conformance and 3GPP pre-conformance testing of O-RUs from Foxconn and other vendors. They also jointly validated an O-RU reference design with components from Analog Devices and Intel. The combined testbed includes the VIAVI TM500 O-RU Tester and ...
The post O-RAN PlugFest results appeared first on Electronics Weekly.
from | Electronics Weekly https://ift.tt/w0MJ4aI
via Yuichun
沒有留言:
張貼留言