Imec has presented options to reduce the metal line resistance at tight metal pitches, mitigating the resistance/capacitance (RC) increase of future interconnects using direct metal patterning. For the first time, high aspect ratio (AR=6) processing of ruthenium (Ru) in a semi-damascene fashion is experimentally shown to result in about 40% resistance reduction without sacrificing area. ...
The post Imec’s options to reduce metal line resistance at tight pitches appeared first on Electronics Weekly.
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