Micron is shipping 232-layer TLC NAND flash fabbed in Singapore The device delivers I/O speed 2.4GB/s and the chip has a density of 14.6 Gb/mm2. The chip can store 1Tb which allows 2TB chip packages by stacking 16 232-layer dies. Micron has shrunk its packaging and a single chip package measures 11.5mm x 13.5mm (~155mm2). ...
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