2022年9月5日 星期一

Plastic die packaging now in Scotland

Alter Technology has started its plastic die packaging line in Strathclyde. “We have set up the UK’s only QFN plastic package semiconductor line, which has a capacity of several million single die QFN-equivalents per year, with plans to go beyond 10 million next year,” said company CEO Stephen Duffy. “While still a long way off ...

The post Plastic die packaging now in Scotland appeared first on Electronics Weekly.



from | Electronics Weekly https://ift.tt/sbx9wa1
via Yuichun

沒有留言:

張貼留言