Beta Layout is offering a single-source prototyping and small-series manufacturing service for 3D mechatronic interconnect devices (MIDs). It will be demonstrated at the Electronica exhibition in Munich next month. With this prototyping service the company produces circuit carriers of the three-dimensional circuit boards using 3D printing. The advantage of the this technique, says Beta Layout, is that ...
Read full article: Beta Layout prototypes 3D interconnect devices
from News – Electronics Weekly http://ift.tt/2eQxAUT
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