Backside power delivery, which Intel calls PowerVia, is going to be a big factor in the company’s 20A node due in 2024. Putting the power circuitry on the back of the wafer, reduces the area required for front-side logic circuitry by up to 20%. That means the process used for the interconnect layers can be ...
The post Backside power delivery to be a big deal for Intel appeared first on Electronics Weekly.
from News | Electronics Weekly https://ift.tt/sfibLQ7
via Yuichun
沒有留言:
張貼留言