At Electronica today, Onsemi announced a series of silicon mosfets with top-side cooling for automotive motor control and dc-dc conversion. They come in a 5.1 x 7.5mm TCPAK57 package (aka ‘TCPAK10’, recommended footprint 5.2 x 8.7mm) with a 16.5mm2 thermal pad on the top side. “This allows heat to be dissipated directly into a heatsink ...
The post Electronica: Top-cooled mosfets for automotive reach 1mΩ appeared first on Electronics Weekly.
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