Marvell has come up with its 3nm platform for cloud infrastructure ICs fabbed on TSMC processes. 3nm silicon from Marvell includes long reach SerDes, PCIe Gen6 PHY, and several standards-based die-to-die interconnect technologies for managing data flow across the data infrastructure. The IP portfolio is compatible with 2.5D packaging technologies such as TSMC’s 2.5D Chip-on-Wafer-on-Substrate ...
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