2021年11月29日 星期一

Sponsored Content – High Reliability Underfills for Automotive Applications

Exceptional Thermal Fatigue Resistance for Automotive Applications with ALPHA® HiTech® CU21-3240 Underfill. Using standalone SAC solder joints in BGA and CSP assemblies does not provide the level of thermal fatigue resistance required by automotive, aerospace, military and semiconductor manufacturers. To ensure that these assembled components are able to withstand long periods of exposure in harsh ...

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