2019年1月23日 星期三

UFS Ver. 3.0 embedded flash

Toshiba is sampling what it claims to be the industry’s first Universal Flash Storage (UFS) Ver. 3.0 embedded flash memory devices. The new lineup utilizes the company’s  96-layer BiCS FLASH 3D flash memory and is available in three capacities: 128 gigabytes, 256GB and 512GB. With high-speed read/write performance and low power consumption, the new devices are suitable  for ...

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from News – Electronics Weekly http://bit.ly/2T9bv8D
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