2019年1月31日 星期四

Fan-Out packaging growing at 19.4%

The Fan-Out packaging market will grow at 19,4% CAGR 2019-24 to reach $3.8 billion in 2024, forecats Yole Developpment. In 2015, the Fan-Out market was small and consisted mostly of standard devices like BB , RF , and PMU . But after TSMC’s 2016 game-changer with inFO for Apple’s iPhone APE, market value increased 3.5x ...

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from News – Electronics Weekly http://bit.ly/2RXTb61
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