With COF (chip on film) package technology increasingly emerging as a mainstream packaging method for driver ICs for smartphone-use LCD and OLED panels, Taiwan players in the IC packaging sector, including COF substrate maker JMC Electronics, driver IC packaging and testing specialists Chipbond Technology and ChipMOS Techonolgies, will benefit from the lucrative packaging segment, according to industry sources.
from DIGITIMES: IT news from Asia http://ift.tt/2kSfkzm
via Yuichun
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