Aveni, a developer and manufacturer of wet deposition technologies and chemistries for 2D interconnects and 3D through silicon via packaging, has announced it has obtained results that support the continued use of copper in the back end of line (BEOL) for advanced interconnects, at and beyond the 5nm technology node.
from DIGITIMES: IT news from Asia http://ift.tt/2ljEQh8
via Yuichun
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