Chipbond seeking to cement China market share, says chairman

Taiwan-based LCD driver IC packaging and testing service provider Chipbond Technology's latest strategic investment deployments in China are mainly designed to consolidate its market share there amid the increasingly fierce competition and changing market climate, company chairman Wu Fei-jian has said.

from DIGITIMES: IT news from Asia http://ift.tt/2CU7X2p
via Yuichun