Breakthrough in MCCE process to enhance competitiveness of DW-sliced poly-Si wafers

A breakthrough in MCCE (metal-catalyzed chemical etching) technology used in the production of diamond wire (DW)-sliced poly-Si wafers has enhanced significantly the competitiveness of such wafers against mono-Si wafers, according to industry sources.

from DIGITIMES: IT news from Asia http://ift.tt/2AvCIwb
via Yuichun