Macronix to highlight novel SGVC 3D NAND development at 2017 IEDM

Macronix International has disclosed its research on a novel 3D NAND structure, called single-gate vertical channel (SGVC), will be presented as a highlight paper at the 2017 IEEE International Electron Devices Meeting (IEDM) in San Francisco from December 2-6

from DIGITIMES: IT news from Asia http://ift.tt/2AoRDIx
via Yuichun