China is proceeding with systematic deployments in 14nm semiconductor fabrication equipment, process, packaging and materials, which will be fully industrialized in 2018. And the nation will render major support to the development of 5-7nm procesess and 3D memories under its 13th Five-year Development Plan running 2016-2020, according to Ye Tianchun, director of the Institute of Microelectronics under the Chinese Academy of Science.
from DIGITIMES: IT news from Asia http://ift.tt/2v9P4Eg
via Yuichun
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