2017年7月25日 星期二

Infineon to enter packaged silicon microphone market

Infineon will  enter the packaged silicon microphone market with samples of  high performance, low noise MEMS microphones in Q4. Volume production starts in Q1 2018.. The analogue and digital microphones are based on Infineon’s dual backplate MEMS technology with a 70 dB signal-to-noise ratio (SNR) and a  distortion level of 10% at a 135 dB ...

This story continues at Infineon to enter packaged silicon microphone market

Or just read more coverage at Electronics Weekly



from News – Electronics Weekly http://ift.tt/2tVlTDw
via Yuichun

沒有留言:

張貼留言