China-based Shenzhen Deren Electronics has cooperated with Intel to develop USB 3.1 front-panel internal connectors and cables for USB 3.1 Gen2, with the standard expected to become mainstream arising from growing demand for high-speed transfer of images in large volumes, according to the company.
from DIGITIMES: IT news from Asia http://ift.tt/2h2tiQa
via Yuichun
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