China-based Tongfu Microelectronics has struck a deal with the Xiamen Haicang District government to set up a manufacturing base for advanced packaging and testing services locally with investment totaling CNY7 billion (US$), according to a Chinese-language tech.sina.com report.
from DIGITIMES: IT news from Asia http://ift.tt/2tiN6U6
via Yuichun
沒有留言:
張貼留言