TSMC is set to move its 16nm FinFET Plus (16FF+) process to commercial production in the second half of 2015, and plans to introduce a compact version of the 16FF+ process in early 2016, according to president and co-CEO CC Wei. Total production capacity of the foundry's 16nm FinFET processes at the end of 2016 will triple that a year earlier, said Wei.
from DIGITIMES: IT news from Asia http://ift.tt/1HNI6FV
via Yuichun
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