A University of Chicago lab has invented a new kind of solder that can electronically join disparate semiconductors that were impossible to solder before, plus print crystalline-like high-speed transistors as well as revolutionize 3-D printing.
from EETimes: http://ift.tt/1wmIILw
via Yuichun
from EETimes: http://ift.tt/1wmIILw
via Yuichun
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