Chomerics is aiming its latest thermal interface gel at thin heatsink bonds. GEL 50TBL (TBL – thin bond line) offers 5W/m.K bulk thermal conductivity and, “at a minimum bond line thickness of 0.05mm, the apparent thermal conductivity exceeds 10W/m.K”, according to the company. However, “the material is primarily for thin bond lines and is not ...
The post Thermal interface gel for thin bond lines appeared first on Electronics Weekly.
from News | Electronics Weekly https://ift.tt/VSLHvcM
via Yuichun
沒有留言:
張貼留言