ISSCC 2023: 2D materials instead of silicon in the angstrom era?

At ISSCC 2023 in San Francisco, Belgian research lab Imec presented transistor designs shrunk beyond the capabilities of silicon. It argued that finfet and gate-all-around designs can only go so far with silicon as, to get fast access to the carriers inside a channel, the channels have to be so thin that physics takes its ...

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