2023年1月11日 星期三

ACEPACK SMIT packaged bridges

ST has introduced five power-semiconductor bridges in various configurations, housed ST’s ACEPACK SMIT package that eases assembly and enhances power density over conventional TO-style packages. Engineers can choose from two STPOWER 650V MOSFET half bridges, a 600V ultrafast diode bridge, a 1200V half-controlled full-wave rectifier, and a 1200V thyristor-controlled bridge leg. All devices meet automotive-industry ...

The post ACEPACK SMIT packaged bridges appeared first on Electronics Weekly.



from News | Electronics Weekly https://ift.tt/kYeI3vF
via Yuichun

沒有留言:

張貼留言