2020年7月20日 星期一

Applied cracks bottleneck

Applied Materials has  introduced a new technology that claims to remove a critical bottleneck to continued 2D scaling in foundry-logic nodes. Applied’s Selective Tungsten process technology removes the contact resistance bottleneck that impedes transistor power and performance scaling in advanced foundry-logic<. The technology gives chipmakers a new way to build transistor contacts, which are the ...

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