2020年6月29日 星期一

Infineon adds package to CoolSIC module family

Infineon has added another industry standard package to its CoolSiC MOSFET 1200 V module family. The 62 mm device has been designed in half-bridge topology and is based on the trench chip technology. It opens up SiC for applications in the medium power range starting at 250 kW – where silicon reaches the limits of ...

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