2019年9月26日 星期四

BoW for chiplet-to-chiplet interconnect

Avera Semi and the Open Compute Project Foundation (OCP) today announced the availability of the Bunch of Wires (BoW) 0.7  specification for evaluation proposal to enable a broader understanding and participation in the development of the 1.0 specification. The BoW specification defines a chiplet-to-chiplet physical interconnect for power- area- and cost-efficient data transport between chiplets. ...

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