Samsung Electronics' forthcoming Galaxy S9 and S9+, which are expected to be unveiled at MWC 2018, are likely to employ substrate-like PCB (SLP) products to enable more space for components such as dual-lens camera modules to further enhance the functionality of its next-generation smartphones, according to Digitimes Research.
from DIGITIMES: IT news from Asia http://ift.tt/2EOfhxh
via Yuichun
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