Taiwan-based Winbond Electronics, a manufacturer of specialty DRAM and NOR flash memory, expects to break ground on a new 12-inch wafer plant at the Kaohsiung Science Park (KSP), southern Taiwan around the end of second-quarter 2018 or the middle of the year. The new plant will go into operation by 2020, according to the company.
from DIGITIMES: IT news from Asia http://ift.tt/2fQGQvq
via Yuichun
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