To complement its FT602 USB 3.1 (Gen 1) video class FIFO IC, which has now gone into full scale production, FTDI Chip has introduced a pair of accompanying hardware modules. The UMFT602A and UMFT602X units enable bridging of a FIFO bus to a USB3.0/1 host and are equipped with either HSMC or FMC (LPC) connectors. ...
Read full article: FTDI Chip launches USB 3.1 evaluation modules
from News – Electronics Weekly http://ift.tt/2p10syH
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