Seeing demand for NAND flash storage rising and memory makers accelerating their development of 3D NAND flash products, Intel is planning to begin mass producing new 3D NAND flash products in 2017 to compete for datacenter, professional, consumer and embedded markets, which may pose a challenge for existing players including Samsung Electronics, SK Hynix, Toshiba and China-based players, according to sources from the upstream supply chain.
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