Cadence Design Systems has announced the immediate availability of an integrated system design solution for TSMC's advanced wafer-level integrated fan-out (InFO) packaging technology, resulting from a collaboration between Cadence and TSMC that was announced earlier in 2016.
from DIGITIMES: IT news from Asia http://ift.tt/2dolOV9
via Yuichun
沒有留言:
張貼留言