Korean process engineers have developed a chip packaging technology that creates flexible integrated circuits. The process starts with a flash memory wafer diced after thinning to ~100nm. These die are attached to a plastic carrier film, which allows them to be transferred to a roller and pressed onto a flexible PCB supported by a flat ...
Read full article: Korea develops roll-based packaging for flexible silicon ICs
from News – Electronics Weekly http://ift.tt/2byf05h
via Yuichun
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