Imec is getting closer to implementing DSA (directed self-assembly) for via patterning at the N7 technology node and beyond. DSA processes with cylinder-forming block copolymers (BCP) have gained attention for contact hole shrink applications with improved contact hole roughness, and for their potential to increase the contact hole density that is obtained with optical lithography. ...
Imec shows directed self-assembly-formed vias
from ElectronicsWeekly » News http://ift.tt/1TI3G6S
via Yuichun
沒有留言:
張貼留言