Cypress and foundry Shanghai Huali Microelectronics Corporation (HLMC), have developed functioning silicon cells using Cypress’s Sonos (silicon oxide nitride oxide silicon) 55nm embedded flash.
The silicon cells are designed for smartcards and the Internet of Things (IoT).
The technology and design IP will be available for high-volume manufacturing by HLMC customers in the second half of 2015.
HLMC licensed Cypress’s 55nm Sonos embedded nonvolatile memory (NVM) process in January 2014.
Sonos only requires three mask layers to insert it into a standard CMOS process compared with the nine to 12 additional masks generally needed for other embedded Flash technologies. This mask reduction results in lower manufacturing costs.
Sonos does not alter standard device characteristics or models when it is added to baseline CMOS process, preserving existing design IP.
It promises high yields and reliability, 10 years of data retention, 100,000 program/erase endurance cycles, and resistance to soft errors.
Cypress has demonstrated the ability to scale Sonos to 40nm and 28nm nodes.
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