2014年4月28日 星期一

Winbond to hike 2014 capex for capacity ramps

Taiwan-based specialty DRAM and NOR flash maker Winbond Electronics will increase its capex for 2014 in order to ramp up its production capacity to meet increasing demand for specialty DRAM and flash chips from the smartphone, Internet of Things (IoT) and wearable device sectors, according to the company.



from DIGITIMES: IT news from Asia http://ift.tt/1nYas5O

via Yuichun

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