BSIMProPlus
ProPlus Design Solutions, the SPICE modelling specialist which spun out of Cadence eight years ago, says it has “re-innovated” its BSIMProPlus platform to support 14/16nm finfet and sub-28nm FD-SOI.
BSIMProPlus’ simulation, extraction and optimisation engines have been silicon validated by more than 100 customers worldwide, including all leading foundries, top IDMs and fabless companies, says ProPlus.
A new GUI and consolidated modelling flows deliver a 3x performance improvement over the last product, says Pro-Plus.
An innovation is the tight integration of a full-parallel SPICE engine known as NanoSpice the parallel SPICE simulator for giga-scale circuit simulation.
NanoSpice enables BSIMProPlus to handle any complicated models for all types of devices and modelling targets.
For example, modelling engineers can use BSIMProPlus to generate SPICE models for SRAM by tuning parameters to fit targets at both device and SRAM cell level, such as cell read current, cell leakage or Static Noise Margin (SNM).
The built-in SPICE engine also makes BSIMProPlus a unified modelling environment for all modelling requirements, including IV/CV, RF, 1/f and thermal noise, LDE, statistical and corner, reliability and other customized modelling.
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