Globalfoundries and NXP Semiconductor have jointly developed a next-generation embedded non-volatile memory (eNVM), which has resulted in production of 300mm prototype wafers on Globalfoundries' 40nm process technology platform, according to the companies. Volume production is expected in 2016 at its Singapore facility.
from DIGITIMES: IT news from Asia http://ift.tt/1NeQuia
via Yuichun
from DIGITIMES: IT news from Asia http://ift.tt/1NeQuia
via Yuichun
沒有留言:
張貼留言