Qualcomm is doing extensive research into how to build 3D structures on a single die without having to use through-silicon-vias (TSVs) and hopes to introduce 3D SoCs by 2016.
from EETimes: http://ift.tt/1GchqyI
via Yuichun
from EETimes: http://ift.tt/1GchqyI
via Yuichun
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