Silicon results on 16FF show the “big” Cortex-A57 processor achieving 2.3GHz for sustained mobile peak performance, as well as the “LITTLE” Cortex-A53 processor consuming only 75mW for most common workloads.
The performance improvements are a result of the collaboration between ARM and TSMC to jointly optimise the 64-bit ARMv8-A processor series on FinFET process technologies and build on the successful tape-out of the Cortex-A57 processor on TSMC’s 16FF process last year.
TSMC and ARM claim new benchmarks for performance and power efficiency with first announced FinFET silicon with 64-bit ARM big.LITTLE technology
TSMC and ARM today announced the results from a key FinFET silicon validation of the ARM big.LITTLETM implementation, using ARM Cortex-A57 and Cortex-A53 processors on TSMC’s 16nm FinFET (16FF) process technology.
Silicon results on 16FF show the “big” Cortex-A57 processor achieving 2.3GHz for sustained mobile peak performance, as well as the “LITTLE” Cortex-A53 processor consuming only 75mW for most common workloads.
The performance improvements are a result of the collaboration between ARM and TSMC to jointly optimise the 64-bit ARMv8-A processor series on FinFET process technologies and build on the successful tape-out of the Cortex-A57 processor on TSMC’s 16FF process last year.
Ongoing collaborative efforts are focused on TSMC’s 16FF+ process technology which will deliver an additional 11% gain in performance for the Cortex-A57 at the same power as the 16FF process, along with a further 35% power reduction for the Cortex-A53 when running low-intensity applications.
This further increases the dynamic performance range and power savings for big.LITTLE platforms. 16FF+ is scheduled to be delivered by Q4 2014. Early big.LITTLE implementations of Cortex-A57 and Cortex-A53 processors on 16FF+ are supported by ARM POP IP technology.
“This silicon proof point with ARM Cortex-A57 and Cortex-A53 processors demonstrates the additional benefits in performance and power efficiency that 16nm FinFET technology delivers to big.LITTLE implementations,” says ARM evp Pete Hutton, “the joint effort of ARM, TSMC, and TSMC’s OIP design ecosystem partners will transform end-user experiences across the next generation of consumer devices and enterprise infrastructure.”
from News http://ift.tt/1rqhIwv
via Yuichun
沒有留言:
張貼留言