eGaN chipset shrinks size for high power density design

The ePower chipset family of 100V, 65A IC chipsets integrate a 100V EPC23101 eGaN driver and EPC2302 eGaN FET. Developed by Efficient Power Conversion (EPC), they reduce the solution size for high power density applications, including 48V DC-DC conversion in computing and brushless DC (BLDC) motor drives for e-mobility, robotics and drones. The ePower chipset is capable of a ...

This story continues at eGaN chipset shrinks size for high power density design

Or just read more coverage at Electronics Weekly

from News – Electronics Weekly https://ift.tt/33OoK9f
via Yuichun