UTAC Holdings, a Singapore-based semiconductor testing and assembly services provider, has introduced two new offerings to bolster its quad flat no-lead (QFN) portfolio - a 0.3mm thin QFN package and a side lead plating (SLP) process that improves QFN solder joints for automotive, aerospace and other harsh environmental applications. Both offerings are qualified with major customers and scheduled to go into mass production in the second half of 2015.
from DIGITIMES: IT news from Asia http://ift.tt/1FwXt4x
via Yuichun
from DIGITIMES: IT news from Asia http://ift.tt/1FwXt4x
via Yuichun
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