TSL2584 block diagram
A tiny ambient light sensor from ams uses through-silicon via (TSV) packaging to achieve a footprint of just 1.145 x 1.66mm and a height of 0.32mm.
The TSV package does not need wire bonds and provides a direct connection from the device I/Os to a solder ball.
The TSL2584TSV’s incorporates interference filters which are deposited directly onto the silicon. Filtering out un-wanted IR light enables the sensor to accurately measure the ambient light and to produce what the supplier calls “a near-photopic response”.
According to David Moon, senior marketing manager in the Advanced Optical Solutions division of ams: ” With a footprint of less than 2mm2 and a height of only 0.32mm the TSL2584TSV marks a major milestone in the development of ALS solutions, opening up many new options for implementing display management in highly space-constrained designs.’
The TSL2584TSV is available for volume production and an evaluation kit is also available .
from News http://ift.tt/1GEEQMz
via Yuichun
沒有留言:
張貼留言