Altera, TSMC develop UBM-free WLCSP packaging

Altera and TSMC have produced an UBM-free (under-bump metallization-free) WLCSP (wafer-level chip scale package) technology for Altera's MAX 10 FPGA products, according to the companies.



from DIGITIMES: IT news from Asia http://ift.tt/1ajhWyN

via Yuichun