Altera, TSMC Announce First UBM-Free Packaging for MAX 10 FPGAs

Altera Corp. and foundry supplier Taiwan Semiconductor Manufacturing Co. cooperate on first UBM-free (under-bump metallization-free) WLCSP (wafer-level chip scale package) technology, despite speculation about Intel being in talks to acquire Altera.



from EETimes: http://ift.tt/1FiqDSm

via Yuichun