JEDEC has adopted a pair of top-side-cooled surface-mount packages created by Infineon for high-voltage mosfet. Dubbed QDPAK and DDPAK (in-use, below left), they are intended to replace through hole TO247 and TO220 (respectively) and “deliver equivalent thermal capabilities with improved electrical performance”, said Infineon. “JEDEC package registration, according to MO-354, serves as an enabler for ...
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