At ISSCC this week in San Francisco, the University of California and Murata described a way to take point-of-load conversion to the next level – two-stage conversion with vertical current paths and package-level integration. Point-of-load schemes have solved the problems of I2R losses across PCBs for a long time, but the traditional approach of putting ...
The post ISSCC 2023: Point-of-load conversion at the next level appeared first on Electronics Weekly.
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